Details
Application:
Attaching, Bonding, CMP, Laminating
Backing (Carrier) Material:
Backing (Carrier) Thickness (Imperial):
Backing (Carrier) Thickness (Metric):
Base - Metric Height Dimension:
Base - Metric Length Dimension:
Base - Metric Width Dimension:
Global Product Hierarchy:
Tapes > Bonding, Mounting & Transfer Tapes > Bonding Tapes
Harmonized Tariff Schedule Nbr:
Maximum Operating Temperature (Celsius):
Maximum Operating Temperature (Fahrenheit):
Minimum Operating Temperature (Celsius):
Minimum Operating Temperature (Fahrenheit):
Overall Width (Imperial):
Pallet - Pallet Layer Quantity:
Pallet - Previous Packaging Level Unit:
Pallet - Shipping Container Per Layer Quantity:
Pallet - Total Unit Quantity:
Primary Liner:
Polycoated Bleached Kraft Paper
Primary Liner Thickness (Imperial):
Primary Liner Thickness (Metric):
Return Policy Description:
Shipper - Previous Packaging Level Quantity:
Shipper - Total Unit Quantity:
Tensile Strength (Imperial):
Tensile Strength (Metric):
Total Tape Thickness without Liner (Imperial):
Total Tape Thickness without Liner (Metric):
Unnamed: 108:
Attaches polishing pads to platens for chemical mechanical planarization (CMP) in semiconductor manufacturing Rubber based adhesive provides fast, reliable bonding strength and removes cleanly Adhesive is applied to film carrier on both sides for effective
